Wafer Cutting Machine
Detailed Product Description
Cutting materials ; Silicone wafer, Glass, Ajpphire, LED, LED, MeMS, Ceramics, GaN, GaAs,Zirconia
Semi automatic dicing machine
Operation system ; Motion PC(PMAC) + Touch screen
Wafer Cutting Machine
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Company Info
AARON CO LTD
[South Korea]
[Verified Member]
Online Postings: Products
Business Type:Manufacturer
City: Hwaseong City
Province/State: Gyeonggi-do
Country/Region : South Korea
